Encapsulation and Potting

Potting, or encapsulation, is the process of covering a printed circuit board assembly or filling an electromechanical assembly with a protective material. This is often done to absorb shock and vibration and/or to keep moisture and corrosive agents out of the assembly.

In some instances, customers may desire to protect their intellectual property at the electronic component level. Potting material can be used to mask component identification markings with an opaque (or non-transparent) coating.  Encapsulation and potting are common methods of providing intellectual property protection in the electronics manufacturing industry.

SMD provides encapsulation and potting services as an addition to their suite of contract electronics manufacturing services. SMD has been serving customers across the US for more than 25 years. Put our expertise to work on your next project. Contact SMD to learn more or to request a quote.